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SAIM College and Tokma Technologies Sign Agreement for Academia-Industry Collaboration

May 13, 2025
SAIM College and Tokma Technologies Sign Agreement for Academia-Industry Collaboration

South Asian Institute of Management (SAIM College) and Tokma Technologies Pvt. Ltd. have signed a Memorandum of Understanding (MoU) to strengthen cooperation between academic institutions and the tech industry. The agreement aims to promote skill development, research, and technological innovation in Nepal.

The MoU was signed during a special event held in Lalitpur, with the Principal of SAIM College, Mr. Ashok Raj Pandey, and the director of Tokma Technologies, Mr. Sagar Angdembe, representing their respective institutions. Mr. Sumanta Gurung, Program Director at SAIM College, was also present as a witness to the signing ceremony.

As per the agreement, students will benefit from industry-related internships, joint research projects, curriculum enhancement, workshops, expert-led sessions, hackathons, and innovation challenges, all designed to equip them with practical knowledge and skills.

Vice President of the Federation of Computer Association Nepal and CEO of One Cover Pvt. Ltd., Mr. Chiranjeevi Adhikari, described the collaboration as an ‘impactful initiative’. He remarked, “This partnership between SAIM College and Tokma Technologies will prepare Nepalese youth to be industry-ready.” According to him, the move aligns with Nepal’s national goal of becoming an IT hub.


Highlighting the importance of academic-industry collaboration in the current education system, SAIM College Principal Ashok Raj Pandey stated, “This agreement is a significant step toward providing our students with practical knowledge and making them competitive in the future digital economy.”

The agreement will remain effective for three years and may be extended upon mutual consent. The MoU outlines the responsibilities of both parties. SAIM College will recommend students for internships and projects, provide necessary academic support and infrastructure, and coordinate with faculty for joint projects.

Similarly, Tokma Technologies will offer internships and research opportunities, provide industry-related guidance and expert sessions for students and faculty, participate in curriculum reviews, and organize joint programs.

Both institutions expressed confidence that this collaboration will foster research, promote entrepreneurship, and enhance students’ prospects of employment. In conclusion, this strategic partnership will elevate the relationship between Nepal’s academic institutions and the tech industry to new heights.

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KMC Balkumari